The new adhesivesVitralit UD 8055 and Vitralit UD 8056 from Panacol are ideal for use as sensor encapsulation, encapsulation, component protection on PCBs and for mixed bonding of plastics and metals - especially when there are component undercuts or geometry-related cavities. This is because process-reliable curing even in shadow zones is guaranteed here by the secondary curing mechanism of the two adhesive systems.
In the first step, the bonded areas are cured and fixed in seconds by UV radiation. In the second step, uncured monomers in shadow areas are crosslinked by atmospheric humidity without stress and without thermal exposure. This technology enables fast cycle times and high volume production without subjecting temperature-sensitive electronics or components to thermal stress.