Advances in microelectronics are increasing the demand for measurements of structural details. With the TopMap Micro.View+, Polytec has a high-resolution microscope-based white light interferometer in its program for this purpose. The color information (RGB) provided in addition to the height measurement simplifies defect assignment. Equipped with motorized axes, a travel range of 200 x 200 x 100 mm³ and a likewise motorized objective turret, test sequences can be carried out automatically according to specific "recipes", the sample height can be measured up to 370 mm and the measuring head can also be integrated separately directly in the production line.
At the Institute for Microelectronics, the high-resolution inspection system has already proven itself in practical use for inspecting the surface of flexible hybrid electronics. The chips embedded on a polyimide film are overlaid and wired. For quality control, the fine structures of the four-layer structure must be inspected. The 3D measurement data from the white light interferometers can be processed with any suitable evaluation software. This is particularly easy with the TMS software specially developed for these topography measuring systems. It allows the measurement results to be evaluated quickly and in compliance with ISO standards. In addition, the software can be individually modified. This means that internal knowledge remains within the company and it is possible to react flexibly to changing requirements.