With Auruna 3408, Umicore Metal Deposition Solutions is launching a gold-copper electrolyte on the market that does not require cyanide or metallic grain refiners such as arsenic, thallium, lead or cadmium. Users therefore require neither special protective equipment nor complex exhaust air systems. Disposal is also simplified as no toxic residues are produced. With a fine gold content of 99.7 %, the bright yellow high-gloss coatings achieve a hardness of around 180 HV and high corrosion resistance. Layer thicknesses of up to 10 µm are possible at a gold concentration of just 5 g/l; at 20 g/l, layers of up to around 200 µm can be produced without cracking. The low-stress and abrasion-resistant coatings are therefore suitable for both decorative and technical applications.
Use in decorative and technical areas
In the decorative segment, the electrolyte enables resistant surfaces for jewelry, watches or spectacle frames. In technical applications such as connectors or contact surfaces, the layers offer good electrical conductivity and abrasion resistance. In PCB production, the smooth surface supports reliable adhesion for solder and bonding wire and is compatible with common materials such as copper, nickel or solder resist. Special requirements from the high-tech and defense sectors can also be met.
Integration into existing processes
The electrolyte can be used in rack and barrel processes and integrated into existing lines. The wide process window simplifies application in automated processes. Supplementary solutions enable simple refreshing and reduce downtimes. Umicore also supports users with technical advice, sampling and regular process service.