In cooperation with the Material Engineering Center Saar (MECS), TE Connectivity has developed an award-winning technology for embedding auxiliary materials in DLIP surfaces of connectors. This technology is now being integrated into the Surfunction GmbH portfolio as part of a cooperation. It can be used to significantly improve the tribological properties of connectors. In combination with Surfunction's expertise, a reduction in yield forces in the double-digit percentage range can be achieved.
Expansion of the cooperation
"The license agreement with TE Connectivity and the expansion of our cooperation is another milestone in our mission to develop revolutionary surface solutions and bring them into industrial applications," says Dr. Dominik Britz, CEO of Surfunction GmbH. In combination with the new ELIPSYS platform, Surfunction can complete its portfolio and value proposition in the application area of connectors. The functionalization of connectors will also be available in a modular integrated DLIP series system.
Functional microstructures on surfaces
The Direct Laser Interference Patterning (DLIP) process used here utilizes the physical principle of interference of laser light to create functional microstructures on surfaces. At the same time, the targeted embedding of additives in the surface of the connectors ensures a permanent tribological improvement over many cycles. This forms the basis for long-term low insertion and withdrawal forces with maximum safety.