The Helmut Fischer Group will present its portfolio for surface quality assurance in the electronics industry at electronica 2026 in Munich. On display will be measurement and analysis instruments for coating thickness measurement and material analysis on printed circuit boards, wafers, connectors, wires, and other electronic components. The highlight of the exhibition booth is the new Fischerscope XDAL 650.
This high-end XRF instrument is designed for the precise measurement of thin and complex coatings as well as for material analysis in the ppm range. Among the applications mentioned is, for example, the determination of phosphorus content in NiP coatings. In addition, the system is suitable for measuring functional coatings in the electronics and semiconductor industries, for example on lead frames, connectors, or printed circuit boards. When used in conjunction with the FISIQ® X software, measurement procedures can be carried out quickly and reproducibly.
Measurement Tasks in Electronics and Semiconductors
Also on display at the booth is the Fischerscope X-RAY XDV-µ Wafer. This benchtop instrument is designed for measuring the smallest structures on wafers up to 12 inches in diameter and for analyzing very thin coatings. According to the company, the Ultra microfocus X-ray tube ensures high measurement performance even with very small spot sizes.
The exhibition presence is complemented by additional instruments for various testing tasks. These include the SR-SCOPE® DMP®30 for measuring copper thickness on printed circuit boards. Fischer is also showcasing various tactile handheld devices and measuring probes for coating thickness measurement, including the DMP®10-40 series.
Trade Show in Munich
electronica 2026 will take place from November 10–13 in Munich. Helmut Fischer will be located in Hall A4, Booth 648. There, the company aims to reach users in the electronics and semiconductor manufacturing industries who require precise measurement technology for smaller structures and increasing quality demands.