This year's Copper Symposium took place in Jena at the end of November. The program was rounded off with excursions to companies and institutes.The Otto Schott Institute for Materials Research at Friedrich Schiller University Jena was the symposium's cooperation partner. The program covered a broad spectrum of research and application of copper materials. This year's main topics were hydrogen, simulation/modeling, digitalization, new materials, additive manufacturing, joining, process engineering as well as nano and surface technology.
The best prepared topics in the poster exhibition were awarded a cash prize, with Maximilian Plötz from TU Munich taking first place for his poster on "Additive processing of copper materials using the liquid metal jetting process".Kilian Brans and Leonhard Nägele from the Laboratory for Machine Tools and Production Engineering (WZL) at RWTH Aachen University also received awards for their contribution "Process-reliable mass production of lead-free connectors" and Dr. Christian Hildmann from TU Dresden for his presentation on the behavior of formed joints under load with fault currents. The Copper Symposium 2025 will be held in cooperation with the fem Forschungsinstitut Edelmetalle + Metallchemie in Schwäbisch Gmünd.