The one-component, epoxy resin-based paste was developed for screen and stencil printing and offers users a high degree of layout flexibility. Thanks to its thermal and electrical properties, it is particularly suitable for use in power-dense assemblies where efficient heat dissipation is crucial.
Optimum thermal coupling
In addition to its thermal conductivity, ELPEPCB HSP 801 S is characterized by a high glass transition temperature (over 150 °C), a low coefficient of thermal expansion and high dielectric strength (DC). The "S" in the product name stands for a particularly smooth surface that enables optimum thermal coupling with the assembly.
Lecture explains details about the material
The company will be presenting its new product in Hall B3, Stand 343, from November 18 to 21. Sven Kramer from Peters will be providing further technical information on the new heatsink paste on the first day of the trade fair, November 18, from 14:00 to 14:30 in Hall B3. There he will explain the material properties and possible applications of the system in modern thermal management of electronic assemblies.