PCIM: Plasmatreat demonstrates possible applications of plasma technology

Anzeige Industrial plasma surface technology | Created by SP

At the PCIM electronics trade fair, Plasmatreat will be presenting live processes for reducing oxide layers and improving the adhesion of various materials in power electronics.

In modern power electronics, power modules are at the heart of many applications. At PCIM Europe 2025 in Nuremberg, Plasmatreat GmbH will be demonstrating how Openair Plasma, PlasmaPlus and the new REDOX application solve key challenges in power module production - even under cleanroom conditions. At booth 169 in hall 7 from May 6 to 8, the focus will be on automated and inline-capable oxide layer reduction and plasma coating to prevent EMC delamination in the overmolding process.

Challenges for power modules

Modern power modules have to withstand high voltages and currents for years. In practice, these include transition temperatures of over 175 °C, electrical voltages in the kilovolt range and power throughputs of several hundred kilowatts. In addition, there are complex requirements for the material connections within the modules - especially at the so-called "triple points", where different materials such as copper, ceramic and potting compounds meet. This is where stresses, air pockets or adhesion problems often occur, which can affect the service life of the modules.

Avoid mechanical failures

The formation of oxide layers on copper surfaces, which lead to increased contact resistance or poor solderability, is particularly critical. Delamination of epoxy potting compounds in the injection molding process also poses a risk that promotes mechanical failures. With its atmospheric pressure plasma solutions, Plasmatreat offers high-performance technologies for surface modification that address these weak points. The dry, chemical-free and VOC-free plasma solutions Openair Plasma, PlasmaPlus and REDOX technology can be integrated inline into manufacturing processes.

Selective inline plasma treatment

Oxide layer reduction using the REDOX tool enables selective inline plasma treatment, which removes oxide layers from metallic surfaces without flux. This optimizes the electrical conductivity and improves the adhesion of connection layers. This technology will be demonstrated live at the trade fair.

Coating with PlasmaPlus

Targeted oxide reduction with REDOX in the inline process is followed by functional coating with PlasmaPlus. This involves applying an adhesion-promoting nano-coating (PT-Bond), which prepares the power module for the subsequent overmolding process. Another highlight at the stand will be the Plasma Treatment Unit (PTU), where surface treatment with open-air plasma and PlasmaPlus will be demonstrated under robotic control.

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