The Holzapfel Group's proprietary process is aimed at the resource-saving and coating-optimized finishing of heat sinks and pin fins for power electronics. The Central Hessian specialist in surface finishing has always focused on helping to shape trends and new developments and can look back on 75 years of electroplating expertise in a wide range of industries.
Strong cooling performance required
Convective air cooling, which used to be sufficient for cooling aluminum heat sinks, is often inadequate for today's applications. The ever more compact and powerful components of power electronics generate significantly more heat - and therefore require a much higher cooling capacity. In addition to the increased temperature, corrosive ambient conditions and encapsulated housings lead to increased demands on durability. Cramped installation conditions pose new challenges for cooling technology. For these reasons, Holzapfel has developed new cleaning and coating processes.
Combination of different processes
These new processes are modular and tailored to customer requirements:
- HG-VRT, a variable rack technology that makes it possible to realize a wide variety of individual motion sequences
- HG-USC, a cleaning concept adapted to the respective product
- HG-PPT, a resource-saving and CO2-reduced solderable nickel layer
- HG-SST, a final functional layer that is deposited exclusively in the immediate functional area as a sulphur- and brightener-free sulphamate nickel layer
- HG-UST, a smart cleaning process for special heat sink/pinfin applications with the highest demands on surface quality and surface cleanliness