SMD adhesive from Panacol bonds with pinpoint accuracy

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Panacol's fast-curing adhesive is suitable for bonding SMDs to printed circuit boards. It is based on epoxy resin and can be easily applied by jet.

Structalit 5604 is a one-component epoxy resin adhesive from Panacol-Elosol GmbH that contrasts well with green PCB material due to its red color. This simplifies optical inline inspection. The one-component adhesive can be dispensed by jet dispenser, classic needle dispensing or screen printing. Its preset viscosity and high thixotropy index enable a high dispensing speed, a precise dot profile and good wet adhesion for the curing process.

Curing occurs thermally within a few minutes, even at low temperatures. Structalit 5604 can withstand extreme temperatures of up to 270° C for a short time and is therefore also suitable for reflow soldering processes. In the cured state, the adhesive is particularly shock-resistant and adheres to FR4 printed circuit boards, to metals and to epoxy-based mold materials. Due to its high glass transition range of >115° C, the adhesive retains its adhesive strength even at elevated temperatures and is therefore suitable for the production of electronic assemblies.

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