ALD technology (Atomic Layer Deposition, ALD), a process for depositing thin-film materials from the gas phase, is no longer just a key component in microelectronics. Its applications extend across numerous branches of industry such as lithium-ion batteries, photovoltaics, optics, lighting, biomedicine and quantum technology.
Diverse conference program around ALD
This year's conference offered a varied program, according to the European Research Association for Thin Films (EFDS) as the organizer. These included tutorials on the basics of ALD technology, insights into the latest advances in this field and numerous opportunities to network with representatives from science and industry. The accompanying exhibition offered companies a platform to increase their visibility and present their products and services to an international audience.
One of this year's highlights was the presentation by Jan Willem Maes, Senior Technologist at ASM in Belgium. He gave an impressive overview of developments in ALD technology in industrial practice and an interesting outlook on future challenges and technological approaches in the coming years.
Microelectronics enters the third dimension
In microelectronics, developments are moving into the third dimension; electronic components are no longer just made up of complex 2D circuits. Interconnection technologies must now also be implemented in the z-axis, resulting in new requirements for manufacturing processes. Electronic architectures need to be rethought. Some of the sought-after solutions have already been successfully implemented using ALD technologies. Others are still under development. For example, additional layers and connections must be placed on existing structures, which significantly narrows the process window of the subsequent steps. Milder process conditions are becoming a necessity in order not to damage existing components.
Dielectric layers have been discussed in many ways. From the underlying precursors to the process-specific influences on the layer structures and the optimization of properties, there were some interesting contributions that highlighted the corresponding processes and new developments. Here, too, more complex cycles are required in the process sequences. A new variant of area-sensitive deposition using pre-treatment and inhibition steps was presented.
ALD makes PEM electrolysis more cost-effective
The second day was dedicated to energy technology applications for batteries, electrolysis, fuel and solar cells as well as optical applications. The company Spark-Nano, for example, is working on scaling up manufacturing processes for PEM electrolysis membranes for the production of green hydrogen. Here, large quantities of rare iridium are used as a catalyst. By using efficient catalytic thin films, future membranes can be produced much more efficiently and cost-effectively. For this purpose, catalytic layers are produced and stabilized using ALD. The accessibility of the surfaces to be coated and the homogeneity of the layers produced with optimum catalyst loading are a major challenge, as Paul Poodt reported in his article.
Wojciech Gajewski from Trumpf Hüttinger compared various plasma-based processes in his presentation and pointed out the resulting differences in the ALD layers that can be produced by using different plasma sources and process parameters during the manufacturing process.
Suo Li from Afly Solution Oy presented the developments of recent years in the field of optical functional layers for consumer electronics and amazed some users of smartphones and cameras with technical details that are already being used in today's devices in the high-price segment and will be standard in the future.
Those who were unable to get one of the presentation slots had the opportunity to present their work in the poster session. Here too, a broad spectrum of development results was presented.